{"id":682,"date":"2026-06-27T10:41:05","date_gmt":"2026-06-27T07:41:05","guid":{"rendered":"https:\/\/dymet.ee\/?page_id=682"},"modified":"2026-06-27T11:11:47","modified_gmt":"2026-06-27T08:11:47","slug":"rd-functional-conductive-metallization-on-engineering-polymers","status":"publish","type":"page","link":"https:\/\/dymet.ee\/ee\/services\/rd-functional-conductive-metallization-on-engineering-polymers\/","title":{"rendered":"R&amp;D \u2013 Functional Conductive Metallization on Engineering Polymers"},"content":{"rendered":"\n<div id=\"attachment_684\" style=\"width: 310px\" class=\"wp-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-684\" class=\"size-medium wp-image-684\" src=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-300x200.png\" alt=\"Conductive metal coating on PEEK polymer substrate created by low-pressure cold spray (LPCS) metallization process for structural electronics applications\" width=\"300\" height=\"200\" srcset=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-300x200.png 300w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-1024x683.png 1024w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-768x512.png 768w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-150x100.png 150w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-225x150.png 225w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626-600x400.png 600w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/69FB7909-BFC5-441D-94A2-00262E5A2626.png 1536w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><p id=\"caption-attachment-684\" class=\"wp-caption-text\">Conductive metal coating on PEEK polymer substrate created by low-pressure cold spray (LPCS) metallization process for structural electronics applications<\/p><\/div>\n<p class=\"PDq2pG_selectionAnchorContainer\" data-start=\"256\" data-end=\"494\">We have developed a novel powder system and a low-pressure cold spray (LPCS) process enabling the direct deposition of electrically conductive metallic coatings onto engineering polymers, including high-performance materials such as PEEK.<\/p>\n<p data-start=\"496\" data-end=\"859\">The process forms a dense, adherent and electrically functional metal layer directly on polymer substrates without the use of electroplating, conductive adhesives, or intermediate bonding layers. This enables a new class of <strong data-start=\"720\" data-end=\"768\">structurally integrated conductive materials<\/strong>, where electrical functionality is embedded directly into load-bearing plastic components.<\/p>\n<p data-start=\"861\" data-end=\"910\">Initial experimental validation has demonstrated:<\/p>\n<ul data-start=\"912\" data-end=\"1314\">\n<li data-section-id=\"8rzunb\" data-start=\"912\" data-end=\"1025\">Stable electrical conductivity suitable for power transmission applications (up to 16 A in preliminary tests)<\/li>\n<li data-section-id=\"kjpu56\" data-start=\"1026\" data-end=\"1111\">Strong adhesion of metallic layers to polymer substrates under mechanical loading<\/li>\n<li data-section-id=\"a4apr9\" data-start=\"1112\" data-end=\"1207\">Resistance to delamination under static mechanical stress, including load tests up to 10 kg<\/li>\n<li data-section-id=\"10cpxvr\" data-start=\"1208\" data-end=\"1314\">Direct solderability of the deposited metallic layer, enabling conventional electronic interconnection<\/li>\n<\/ul>\n<p data-start=\"1316\" data-end=\"1545\">The process operates within a controlled LPCS parameter window, where gas pressure, temperature, stand-off distance, and engineered powder composition are critical to achieving repeatable coating formation and stable performance.<\/p>\n<p data-start=\"1547\" data-end=\"1748\">This approach differs from conventional polymer metallization techniques by enabling <strong data-start=\"1632\" data-end=\"1747\">functional, load-resistant metallic layers rather than purely decorative or low-performance conductive coatings<\/strong>.<\/p>\n<h3 data-section-id=\"1spi9nd\" data-start=\"1750\" data-end=\"1785\">Application potential includes:<\/h3>\n<ul data-start=\"1786\" data-end=\"2107\">\n<li data-section-id=\"1dpev87\" data-start=\"1786\" data-end=\"1843\">structural electronics and conductive polymer systems<\/li>\n<li data-section-id=\"17vmnu9\" data-start=\"1844\" data-end=\"1922\">replacement of internal wiring harnesses with embedded conductive pathways<\/li>\n<li data-section-id=\"f9o9pw\" data-start=\"1923\" data-end=\"1984\">lightweight electronic integration in mechanical housings<\/li>\n<li data-section-id=\"ks8pff\" data-start=\"1985\" data-end=\"2044\">RF structures and antenna systems on polymer substrates<\/li>\n<li data-section-id=\"1niju5e\" data-start=\"2045\" data-end=\"2107\">robotics, UAV systems, and advanced industrial electronics<\/li>\n<\/ul>\n<p data-start=\"2109\" data-end=\"2391\">The technology is currently under continued development, including detailed characterization of adhesion mechanisms, microstructure, electrical performance, thermal stability, and long-term reliability. Independent validation and industrial collaboration are actively being pursued.<\/p>\n<p data-start=\"2393\" data-end=\"2625\">This development represents a step toward <strong data-start=\"2435\" data-end=\"2502\">fully functional electronic integration in engineering polymers<\/strong>, enabling new design architectures where mechanical and electrical functions are combined within a single material system.<\/p>\n<hr data-start=\"2627\" data-end=\"2630\" \/>\n<div id=\"attachment_685\" style=\"width: 235px\" class=\"wp-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-685\" class=\"size-medium wp-image-685\" src=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213-225x300.png\" alt=\"Conductive metal coating deposited on PEEK polymer using low-pressure cold spray (LPCS) process\" width=\"225\" height=\"300\" srcset=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213-225x300.png 225w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213-768x1024.png 768w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213-112x150.png 112w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213-450x600.png 450w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213-600x800.png 600w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6213.png 896w\" sizes=\"auto, (max-width: 225px) 100vw, 225px\" \/><p id=\"caption-attachment-685\" class=\"wp-caption-text\">Electrically conductive metallic layer directly applied to high-performance PEEK polymer substrate.<\/p><\/div>\n<div id=\"attachment_689\" style=\"width: 195px\" class=\"wp-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-689\" class=\"size-medium wp-image-689\" src=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-185x300.jpeg\" alt=\"Soldered copper wire attached to conductive metal coating on PEEK polymer demonstrating electrical connectivity\" width=\"185\" height=\"300\" srcset=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-185x300.jpeg 185w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-632x1024.jpeg 632w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-768x1244.jpeg 768w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-948x1536.jpeg 948w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-93x150.jpeg 93w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-370x600.jpeg 370w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124-600x972.jpeg 600w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6124.jpeg 1107w\" sizes=\"auto, (max-width: 185px) 100vw, 185px\" \/><p id=\"caption-attachment-689\" class=\"wp-caption-text\">Direct soldering of copper wire onto LPCS-deposited conductive polymer coating.<\/p><\/div>\n<div id=\"attachment_688\" style=\"width: 235px\" class=\"wp-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-688\" class=\"size-medium wp-image-688\" src=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-225x300.jpeg\" alt=\"Mechanical load test of conductive polymer coating on PEEK showing 10 kg suspended weight without delamination\" width=\"225\" height=\"300\" srcset=\"https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-225x300.jpeg 225w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-768x1024.jpeg 768w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-1152x1536.jpeg 1152w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-1536x2048.jpeg 1536w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-113x150.jpeg 113w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-450x600.jpeg 450w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-600x800.jpeg 600w, https:\/\/dymet.ee\/wp-content\/uploads\/2026\/06\/IMG_6229-scaled.jpeg 1920w\" sizes=\"auto, (max-width: 225px) 100vw, 225px\" \/><p id=\"caption-attachment-688\" class=\"wp-caption-text\">Conductive coating maintains integrity under static mechanical load testing.<\/p><\/div>\n","protected":false},"excerpt":{"rendered":"<p>We have developed a novel powder system and a low-pressure cold spray (LPCS) process enabling the direct deposition of electrically conductive metallic coatings onto engineering polymers, including high-performance materials such as PEEK. The process forms a dense, adherent and electrically functional metal layer directly on polymer substrates without the use \u2026 <a class=\"continue-reading-link\" href=\"https:\/\/dymet.ee\/ee\/services\/rd-functional-conductive-metallization-on-engineering-polymers\/\"> Continue reading <span class=\"meta-nav\">&rarr; <\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":45,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"two_page_speed":[],"footnotes":""},"class_list":["post-682","page","type-page","status-publish","hentry"],"translation":{"provider":"WPGlobus","version":"3.0.2","language":"ee","enabled_languages":["en","ee","fi","ru","fr","es","it","de"],"languages":{"en":{"title":true,"content":true,"excerpt":false},"ee":{"title":false,"content":false,"excerpt":false},"fi":{"title":false,"content":false,"excerpt":false},"ru":{"title":false,"content":false,"excerpt":false},"fr":{"title":false,"content":false,"excerpt":false},"es":{"title":false,"content":false,"excerpt":false},"it":{"title":false,"content":false,"excerpt":false},"de":{"title":false,"content":false,"excerpt":false}}},"_links":{"self":[{"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/pages\/682","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/comments?post=682"}],"version-history":[{"count":3,"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/pages\/682\/revisions"}],"predecessor-version":[{"id":691,"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/pages\/682\/revisions\/691"}],"up":[{"embeddable":true,"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/pages\/45"}],"wp:attachment":[{"href":"https:\/\/dymet.ee\/ee\/wp-json\/wp\/v2\/media?parent=682"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}