Polveri in metallo

Blend name Base metal Additives Destination Remarks
K-80-13
A-80-13		 Aluminum Alumina
Zink		 Build up material to restore shape and volume of metal parts. The small volume of zink additive serves to prevent nozzle clogging.
K-20-11
A-20-11		 Aluminum Alumina
Zink		 Sealing up material to fill slits and holes in metal parts. The volume of zink additive promotes holes and slits plugging.
K-00-11
Z-00-11		 Zink Alumina Corrosion protection at local areas of steel constructions. .
K-01-01
C-01-01		 Copper Alumina Build up material to improve electric and heat conductivity. Electric contacts and conducting lines at any metals and ceramic. Coating for soldering. Aluminum sublayer is required at ceramic substrate.
K-01-11
C-01-11		 Copper Zink Electric contacts and conducting lines at any metals and ceramic. Coating for soldering. Same as MS58-Cu Zn Aluminum sublayer is required at ceramic substrate.
K32
N3-00-02		 Nickel Alumina Protective coating in agressive and high temperature media. Build up material. .
K714
N7-00-14		 Nickel Alumina
Zink		 Sealing up material to fill slits and holes in metal parts, build up material for operating temperatures up to 1200о С. The volume of zink additive promotes holes and slits plugging.
T2-00-05 Tin Alumina Protective coating at electric contacts. .
ТP-63-25 Tin alloy Alumina Protective coating at electric contacts. ___ Sn(63%)-Pb alloy .
B83-100-40 Babbit B83 . Restoration of slide bearings cast-on babbit B83. ___ Sn(83%)-Cu-Sb alloy Special tool SBB-03 is required.
P1-00-01 Lead Alumina Corrosion protection in aggresive media. Porosity and screws sealing up. .
К-00-04-16 . Alumina Blasting media to prepare substrate surface. Increased nozzle insert wear.

 

Blend name Base metal Additives Destination Remarks
K-20-01
A-20-01		 Aluminum Alumina Build up material to restore aluminum part shape. Microscopic leakages sealing up . Corrosion protection. Nozzle insert clogging is possible.
K-10-01
A-10-01		 Aluminum Alumina Build up material to restore aluminum part shape. Microscopic leakages sealing up . Corrosion protection. Nozzle insert clogging is possible at upper temperature settings.
K-10-04
A-10-04		 Aluminum Alumina Prime layering for nickel and copper coating deposition to ceramic substrates. Increased nozzle insert wear.
A-20-10 Aluminum Zink Conducting coatings at glass substrate. Regular deposits buildup at nozzle walls.
C-03-10 Copper Zink Conducting coatings for soldering at glass substrate. Reduced bond strength. Aluminum sublayer is recommended.
C-01-00 Copper . Auto-limited thicness coating for soldering. Reduced deposition efficiency. Rough substrate surface is required.
К-00-04-02 . Alumina Blasting media for ceramic and other sensitive surfaces. Increased nozzle insert wear.

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